| PART |
Description |
Maker |
| P2NS |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| ZTACV-MX ZTTCV-MX |
2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
|
ILSI America LLC
|
| QTH-040-01-F-D-DP-A |
RECOMMENDED PCB LAYOUT
|
Samtec, Inc
|
| AN821 |
NEW LAYOUT INSULATION REQUIREMENT
|
SGS Thomson Microelectronics
|
| AN576 |
PCB LAYOUT OPTIMISATION
|
SGS Thomson Microelectronics
|
| QFP44 |
POD Target Layout
|
iSYSTEM
|
| PG-TO251-3-21 |
Package Outline / Marking Layout
|
Infineon
|
| G8V-1A7T-R |
Micro 280 terminal layout
|
Omron Electronics LLC
|
| AN650 |
Si468X SCHEMATICS AND LAYOUT GUIDE
|
Silicon Laboratories
|
| W682388 |
Pro-X⑩ CODEC Layout Guideline
|
Winbond
|
| RM9W4S-50-ZB |
D-SUB HOUSING MIXED LAYOUT (9W4S)
|
Winchester Electronics ...
|
